CINDBEST CGO-4 | 2" to 6" High and Low Temperature Vacuum Probe Stage Test System

Features/Applications

2" to 6" sample stand

High vacuum cavity

◆ Sample temperature uniformity is improved

77K-675K High/Low Temperature Environment

◆ Compatible with IV/CV/RF Testing

External multi-probe arm, large travel range

Economical and practical, capable of seamless upgrades

Low Temperature Testing:

Because moisture in the air can condense on the wafer during low-temperature atmospheric testing, it may cause excessive leakage or the probe to fail to contact the electrode, resulting in test failure. To avoid this, the moisture inside the vacuum chamber must be pumped out before the test, and the pump must be kept running throughout the testing process.

High-Temperature Non-Oxidation Test:

As the wafer is heated to 300°C, 400°C, 500°C, or even higher temperatures, oxidation becomes increasingly apparent, and the higher the temperature, the more severe the oxidation. Excessive oxidation can lead to electrical errors in the wafer and physical and mechanical deformation. To avoid these issues, the oxygen in the vacuum chamber should be pumped out before testing, and the pump should be kept running throughout the testing process.

During the wafer testing process, the temperature varies between low and high, causing thermal expansion and contraction. As a result, there may be relative displacement between the well-positioned probe and the device electrode. At this point, it is necessary to reposition the probe holder, which is located outside the chamber. We can also opt for an automated probe holder controlled by an operating rod to adjust the probe's position.

◆腔体尺寸：