CSA-8 Automatic Alignment Probe Stand

Key Technical Parameters

Available Sizes: 3 inches, 4 inches, 5 inches, 6 inches, 8 inches

Tested Silicon Wafer Unit Dimensions: 20-200 mil

The X-Y axis is driven by advanced linear motors, travel range: 250mm x 350mm.

X-Y axis resolution: 0.1μm

X-Y axis repositioning accuracy: ≤±1μm

X-Y travel speed: ≥80mm/sec

The Z-axis features a high-precision 4-guide rail structure, effectively ensuring load-bearing capacity and verticality. Travel range: 20mm.

Z-axis movement resolution: 0.1 um

Z-axis repositioning accuracy: ≤±1μm

Z-axis travel speed: ≥20 mm/sec

The Theta axis features a high-precision DD motor, with an angular travel range of ±10° and a Theta angle resolution of 0.00018°.

Mis-measurement Rate: ≤ 1‰

Fully Automatic Alignment Time: ≤ 15 s

Test Speed 45 mil 5.0 pcs/s

50 mil  4.6 pcs/s

87 mil  4.2 pcs/s

Step Resolution: 0.001

Z-axis travel: 0-5mm adjustable

Film stage corner θ adjustment range: ±20°

The CSA-8 automatic alignment probe station can perform automatic alignment testing on chips. It is easy to operate, quick, and offers high test accuracy with MAP display functionality. Connected to the testing instrument, it can automatically complete electrical parameter and functional testing for various transistor cores.

Operation Method

The CSA-8 automatic alignment probe station offers a clear and intuitive touchscreen interface, allowing for a simple touch-and-click operation to complete the automatic alignment test for chips.

In addition, a more concise and convenient keyboard operation method is provided, allowing operators to choose any type of operation based on personal preference and habits.

Machine Function

Equipped with automatic scanning alignment, high alignment accuracy and fast speed, featuring a Windows 7 interface and dynamic map display of the testing process.

Equipped with various testing functions including circular testing, range retesting, edge detection testing, range spotting, recovery testing, rectangular testing, and offline spotting.

Equipped with X, Y, Z three-axis motion structure, the operation software can perform precision compensation for verticality and planarity, ensuring the machine's control accuracy and stability.

Features real-time dotting, offline dotting, and lag dotting functions. The new dotter operates for up to 3 days without leakage, saving 60% of operation time.

Features segmented Z-axis travel motion, divided into basic height, contact height, contact cushioning, overshoot height, and return height, and includes edge probing function to prevent damage to the chip by the probe during testing and poor contact between the probe and the chip.

Test needle hole ratio image (reflective white spots are needle holes)