The PH-A2000+ is Angco's high-performance automated burning machine with four nozzles. It can accommodate up to 8 powerful Angco burning cores AP8000, and the system can be expanded to 64 in total, providing clients with efficient and cost-effective production capacity utilization.

● The highly trusted ANKO IPS automatic machine frame, ensuring stable and reliable performance throughout the entire lifespan of the machine

● The Anko innovative four-nozzle chip pick-and-place system, while achieving high speed and efficiency (UPH2400), also ensures precision in picking and placing and ultra-quiet operation.

Supports WLCSP and various small package sizes for burning

● Integration with MES Manufacturing Execution System ensures full control and traceability of the production process

Featured Features

High-output General-purpose Burner AP8000

● Built-in with 8 burners

● 64 recording stations

Supports Nor Flash/Nand flash, eMMC, UFS, EEPROM, EPROM, MCU, CPLD, CMOS PLD, FPGA, Anti-fuse, and other customer-customized chips

Support various IC packaging types

Intelligent Imaging System

● Two bottom cameras (1.3MP) with IC synchronized correction, one top camera (1.3MP) for positioning at various work stations (including trays, material belts, burn-in stations, etc.)

● Fully automatic IC outline positioning, discarding traditional film board matching, making operation easier and simpler to master

High-precision identification of small chips, supporting 1.0*1.5mm WLCSP chip packaging

● More precise IC pick and place, ensuring stable chip handling and high yield

High yield and high reliability

● Four-nozzle High-Precision IC Pick & Place Component

● Height up to 2400

● Automated real-time material stacking detection

Automatic Infeed and Outfeed Tray (AutoTray) System

● Strictly enforce the separation and placement of incoming and outgoing materials (physical isolation) to minimize the risk of material mixing.

● The automatic tray system is simple and reliable, enhancing system stability

Automatic Coiler (Tape Out)

● Supports both cold-seal and hot-seal packaging

● Supports tape widths of 8~56mm

High precision stepping (+/- 0.04 mm) feeding

Ink dotting mechanism and inkjet printer

● Optional semiconductor dedicated ink dotting mechanism and inkjet printing unit

● Supports automatic unwinding and automatic dolly marking device

✓ Supports dot matrix and character printing

✔ Available in various colors

Product Specifications Sheet