The IPS3000 is a high-performance automated burning machine with dual nozzles launched by Angco, capable of accommodating up to 4 powerful Angco burning cores, the AP8000. The system can be expanded to support up to 32 burning stations, providing clients with efficient and cost-effective production capacity utilization.
● Anco's highly trusted IPS automatic mechanism frame guarantees stable and reliable performance throughout the entire lifespan of the machine
● Newly designed dual-nozzle chip pick-and-place system, achieving high-speed and efficiency (UPH 2500) while ensuring precision in pick-and-place and ultra-quiet operation
System supports various small-size package programming.
● Integration with MES Manufacturing Execution System ensures full control and traceability of the production process
Featured Features
High-output General-purpose Burner AP8000
● Built-in with 4 recording machines and 32 recording stations
Up to 2,500 UPH (Units Per Hour)
● Supported IC Types: UFS, eMMC, Nor/Nand Flash, EEPROM, CPLD, FPGA, Anti-Fuse, and other customer-customized chips/modules
Support various IC packaging styles
Intelligent Image System
● Two bottom cameras (1.3MP) with IC synchronized skew correction, and one top camera (1.3MP) for positioning at various work stations (including trays, material belts, burn-in seats, etc.).
● Fully automatic IC outline positioning, eliminates traditional membrane board matching, making operation easier and more intuitive
High-precision identification of small chips, supporting 2X2mm chip packaging
● Precision IC handling, ensuring stable chip pick-and-place and high yield
High output, high reliability
● Four-nozzle high-precision IC Pick&Place component
● UPH up to 2500
● Automated real-time material stacking detection
Automatic Infeed and Outfeed Trays (AutoTray System)
● Efficient automatic tray system; loading and unloading do not affect UPH
● The automatic tray system is simple and reliable, enhancing system stability.
Automatic Coiling Equipment (Tape Out)
● Simultaneously supports cold and hot seal packaging
● Supports tape widths from 8 to 32mm
High precision stepping (±0.04 mm) feeding
Ink Drop Mechanism & Inkjet Printer
Optional semiconductor-specific dotting ink unit and inkjet printing device
● Supports automatic rewind and automatic tray device marking
✓ Supports dot and character printing
✔ Available in various colors
✓ Ink meets RoHS requirements
Product Specifications Sheet
