Organic silicon thermal conductive electronic sealing adhesive is a low viscosity flame-retardant two-component addition molding organic silicon thermal conductive sealing adhesive, which can be cured at room temperature or by heating, and has the characteristic of faster curing at higher temperatures. During curing, it does not release heat, corrode, or produce by-products, and can be applied to surfaces of materials such as PC (Poly carbonate), PP, ABS, PVC, and metals. Suitable for insulation, waterproof, moisture-proof, mold proof, dustproof of electronic accessories, fixing components, resistant to chemical media, yellowing, and weather aging.