Typical use

-Precision electronic component packaging

-Encapsulation protection for module power supplies and circuit boards with high transparency and restoration requirements

-Production of elastic silicone products

-The production of low hardness silicone products such as chest patches, insoles, shoulder pads, etc.

Usage process:

Before mixing, mix component A and component B thoroughly in their respective containers.

When mixing, a weight ratio of 1:1 between component A and component B should be followed.

F-N840 can be defoamed as needed during use. After stirring the mixture of A and B evenly, it can be placed in a vacuum container and defoamed at 0.08MPa for 5 minutes before being poured for use.

4. The corresponding curing time should be maintained above the temperature given in the technical parameter table before and after curing. If the application thickness is thick, the curing time may exceed. It can be cured at room temperature or by heating. The curing speed of glue is affected by the curing temperature, and it takes a long time to cure in winter. It is recommended to use heating method for curing, curing at 80-100 ℃ for 20 minutes, and curing at room temperature generally takes about 8 hours.