Variety of material types supported, including tube, tray, and roll packaging for recording. Compatible with common IC packaging on the market, with the ability to develop and record corresponding algorithms.

1. Rapid mass production, quick delivery

A variety of full-automatic burning equipment and general-purpose programmers available on-site to meet customers' fast mass production delivery requirements while ensuring product quality.

Comply strictly with ISO9001 production process management to ensure the implementation of quality control measures.

The entire factory implements static protection measures, in compliance with international ESD standards.

We closely collaborate with several courier companies to ensure timely delivery of goods.

Section II: Intelligent Work Process Management System

Harlow Intelligent Process Management System, effectively ensures the safe entry and exit of various different devices

Software update, hardware maintenance

Professional electronic engineer available for maintenance services and development of programming tools at any time.

Real-time software updates and custom software writing services for special features

Section 3: Information Security Prevention

Strictly implement record burning file management and establish a "Confidentiality Agreement" with customers to ensure their intellectual property.

Insure for delivery and financial protection to ensure cargo safety

1. IC Types: MCU/MPU, EPROM, EEPROM, FLASH, Nand Flash, PLD/CPLD, SD Card, TF Card, CF Card, eMMC Card, eMMC, MoviNand, OneNand...

IC Packaging: DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN…

3. IC Packaging: Tray, Tube, Tape interconversion

4. IC Manufacturers: SanDisk, Toshiba, Micron, Samsung, AMD, SST, Intel, AMIC, Winbond, Atmel, Holtek, Fujitsu...