We offer various material handling options, including tube packaging, tray packaging, and coil packaging, all capable of being recorded. Support for common IC packaging is available, allowing for corresponding algorithm recording operations.

Quick mass production and prompt delivery

A variety of fully automated burning equipment and universal programmers are available on-site to meet the client's fast mass production delivery requirements and ensure product quality.

Complies strictly with ISO9001 production process management to ensure the implementation of quality control measures.

The entire factory implements static protection measures, in compliance with international ESD standards.

We collaborate closely with several courier companies to ensure timely delivery of goods.

Part II: Intelligent Work Process Management System

Harlow Intelligent Process Management System, effectively ensures the safe warehousing and shipping of various different devices

Software update, hardware maintenance

Professional electronic engineers available for on-demand maintenance of programmers and tool development.

Real-time software updates and special feature software writing services

Section 3: Information Security Prevention

Strictly implement burn archive management and establish a "Confidentiality Agreement" with customers to ensure the protection of their intellectual property.

Insure shipping and financial protection to ensure goods safety

1. IC Types: MCU/MPU, EPROM, EEPROM, FLASH, Nand Flash, PLD/CPLD, SD Card, TF Card, CF Card, eMMC Card, eMMC, MoviNand, OneNand...

IC Packaging: DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN…

3. IC Packaging: Tray, Tube, Tape conversion

4. IC Manufacturers: SanDisk, Toshiba, Micron, Samsung, AMD, SST, Intel, AMIC, Winbond, Atmel, Holtek, Fujitsu...