chip packagingdetergentCH660

Product Introduction

CH660It is a revolutionary weakly alkaline water-based cleaning agent developed for cleaning residues after chip packaging. It can quickly and effectively remove residual substances such as solder paste, soldering aids, oil stains, dust, etc. after chip packaging. As is well known, with the increasing integration of circuits, the wire spacing and solder joints of chips are becoming finer and finer. The residues generated during these soldering processes, as well as fingerprints, sweat, keratin, and dust, can seriously affect the insulation and stability of packaged components and circuits under the action of air oxidation and moisture, and even cause irreversible damage.CH660Cleaning agents can thoroughly clean residues and dirt, while not corroding or damaging sensitive metals such as aluminum, copper, platinum, and nickel on semiconductor chips, as well as ink characters, special labels, etc. These sensitive metals and special functional materials are prone to oxidation, discoloration, expansion, deformation, and detachment in alkaline environments, eliminating the problems of oxidation, discoloration, expansion, deformation, and detachment caused by traditional acidic and alkaline water-based cleaning agents. They are ideal choices for semiconductor packaging.

Product Features

1. The product has strong cleaning ability and can remove various pollutants and residues.

2. PH is weakly alkaline, especially suitable for cleaning with longer contact time, with good material compatibility and no corrosion damage to the product itself.

3. Using deionized water, no flash point, safe to use.

4. The odor is light and has no impact on the working environment, making it easy for operators to accept

5. High cleaning load capacity, good filtration performance, and ultra long service life

6. excludeVOC components that meet regulatory requirements for VOC emissions

Scope of application

Instructions for Use

CH660It is an alkaline water-based cleaning agent developed for cleaning after chip packaging, suitable for ultrasonic cleaning and spray cleaning processes. Below are separate introductionsCH660Specific applications in the above two cleaning processes.

OneUltrasonic cleaning process

In the ultrasonic cleaning process, the workpiece to be cleaned is immersed in a cleaning tank, and the cavitation, acceleration, and direct flow effects of ultrasonic waves in the cleaning agent are combined with the solubility of the cleaning agent for dirt, so that the dirt layer is dissolved, dispersed, emulsified, or peeled off to achieve the cleaning purpose. Process schematic diagram (Figure)1- As shown in Figure 3)

1. process flow

Ultrasonic cleaning  —→        Ultrasonic Rinse - → Drying - → Completed

SCP110, singleSlot or multiple slots）(Deionized water, singleSlot or multiple slots)

2.Process application parameters

twoSpray cleaning process

The cyclic cleaning system of spray technology can better utilize its advantages of easy filtration, long cleaning life, and less foaming. The spray cleaning process is suitable for large-scale cleaning, completing all processes including chemical cleaning, rinsing, and drying online. Spray cleaning mainly uses medium and high-pressure spray pumps to increase the pressure of the cleaning solution, converting the low flow cleaning solution into a high-speed beam to clean the surface, thereby achieving the purpose of cleaning.

1. Process flow

liquid addition→ Loading (connecting incoming equipment) → Spray cleaning → Spray rinsing → Drying → Unloading

Environmental, Health, and Safety Regulations

CH660It is a neutral water-based cleaning agent that is biodegradable;

The formula does not contain halogens andVOC components;

Safe, no flash point, non combustible;

referenceSpecific prevention and handling instructions for MSDS.

productpackaging

Packaging: Plastic drum,20KG per barrel.

Storage: Store at room temperature in a sealed manner and avoid direct sunlight and high temperature environments. The temperature is generally around0-30℃(32-86℉)。

Shelf life: One year (sealed), please refer to the packaging for the production date.