Lead frame discrete componentsdetergentCH670
Product Introduction
CH670It is a cleaning agent designed for discrete devices, lead frames, and substrates after welding. It can effectively remove high-temperature lead containing solder paste residue after welding, and does not damage the frame material and silicon wafer passivation layer. Can ensure high-quality completion of subsequent processes.
Product Features
1. The product has strong cleaning ability, removing various pollutants and residues.
2. PH is weakly alkaline, especially suitable for cleaning with longer contact time, with good material compatibility and no corrosion damage to the product itself.
3. Using deionized water, no flash point, safe to use.
4. odorQingLight, no impact on the work environment, easily accepted by operators
5. High cleaning load capacity, good filtration performance, and ultra long service life
6. excludeVOC components that meet regulatory requirements for VOC emissions
Scope of application
CH670Applied in ultrasonic cleaning and spray cleaning processes, suitable for cleaning various lead frames and discrete components after welding | ||
Physicochemical parameters | Water based cleaning agentCH670 | |
appearance | Colorlesstransparentliquid | |
Density（25℃）g/cm3 | 1.00±0.05 | |
PHvalue(10g/l H2O) | 9.0-11．0 | |
Boiling range（℃) | 100-255 | |
Flash point（℃) | none | |
Cleaning temperature（℃/℉) | 40-55 | |
halogenwt/wt | 0 | |
water-soluble | soluble | |
Instructions for Use
Below are separate introductionsCH670Specific applications in the above two cleaning processes.
OneUltrasonic cleaning process
In the ultrasonic cleaning process, the workpiece to be cleaned is immersed in a cleaning tank, and the cavitation, acceleration, and direct flow effects of ultrasonic waves in the cleaning agent are combined with the solubility of the cleaning agent for dirt, so that the dirt layer is dissolved, dispersed, emulsified, or peeled off to achieve the cleaning purpose. Process schematic diagram (Figure)1- As shown in Figure 3)
1. process flow
Ultrasonic cleaning —→ Ultrasonic Rinse - → Drying - → Completed
(CH670, SingleSlot or multiple slots）(Deionized water, singleSlot or multiple slots)
2.Process application parameters
project | Ultrasonic cleaning | Ultrasonic Rinse | dry |
medium | CH670 | deionized water | hot air drying |
temperature | 45-55℃ | 45-55℃ | 100-120℃ |
time | 15-20min | 15-25min | ＞20min |
twoSpray cleaning process
The cyclic cleaning system of spray technology can better utilize its advantages of easy filtration, long cleaning life, and less foaming. The spray cleaning process is suitable for large-scale cleaning, completing all processes including chemical cleaning, rinsing, and drying online. Spray cleaning mainly uses medium and high-pressure spray pumps to increase the pressure of the cleaning solution, converting the low flow cleaning solution into a high-speed beam to clean the surface, thereby achieving the purpose of cleaning.
1. Process flow
liquid addition→ Loading (connecting incoming equipment) → Spray cleaning → Spray rinsing → Drying → Unloading
2. Process application parametersproject |
Spray cleaning |
Spray rinsing |
dry |
a segment | The second paragraph | ||
medium | CH670 | deionized water | hot air drying |
temperature | 45-55℃ | 45-55℃ | 100-120℃ |
time | 8-10min | 8-10min | ＞20min |
Environmental, Health, and Safety Regulations
CH670It is a weakly alkaline water-based cleaning agent that is biodegradable;
The formula does not contain halogens andVOC components;
Safe, no flash point, non combustible;
referenceSpecific prevention and handling instructions for MSDS.
productpackaging
Packaging: Plastic drum,20KG per barrel.
Storage: Store at room temperature in a sealed manner and avoid direct sunlight and high temperature environments. The temperature is generally around0-30℃。
Shelf life: One year (sealed), please refer to the packaging for the production date.
