X-ray Inspection Device - Shimadzu X-ray - SMX-1000L Plus

The original SMX-1000/SMX-1000L has been the industry benchmark for inspection machines. Now, we've developed the more streamlined X-ray inspection devices, SMX-1000 Plus/SMX-1000L Plus, on this foundation. The new model has enhanced the highly praised operational performance and simplified the user interface, while larger透视 and exterior images improve readability.

The new system significantly streamlines measurement functions, allowing for quick results with a one-click operation that requires no complex parameter settings; in addition to the rich features such as navigation, step-by-step, teaching, and image overview display on the appearance images, it also introduces new functions like highlighting the concerned area display.

■ Shimadzu X-ray-SMX-1000L Plus Application

The SMX-1000 Plus/SMX-1000L Plus can inspect the connection status (open circuit, contact) of ultra-fine features on high-density populated substrates or BGA/CSP/system LSI chips at high magnification without causing any damage.

■ Shimadzu X-ray-SMX-1000L Plus Features

Further enhance operability

The interface layout has been improved for greater simplicity and clarity, with larger images for more direct task completion compared to older models.

Clear images

Embracing the strengths of the previous model, the flat receiver combined with our image processing technology yields clear images without distortion.

● Oblique Perspective

Viewing from an inclined perspective reveals defects that cannot be seen with vertical perspective.

● Simple Measurement

We utilize our self-developed image processing technology to automatically optimize the originally complex measurement parameters, allowing for a one-click operation to obtain measurement results.

Add VCT component, the equipment becomes a CT unit.

Operation Performance

· Pre-set Inspection Conditions Feature

Due to the rich dynamic information in the captured images, the system can immediately display the optimized image of the desired area (material) by selecting the appropriate settings from the list of inspection conditions without altering the X-ray conditions.

· CCD appearance positioning

With a CCD camera capturing the entire area of the loading platform, the platform's position can be easily moved to the desired observation spot with a simple operation.

· Locate on live image (mouse operation only)

All operations can be completed with just the mouse, allowing operators to focus on their inspection tasks without having to take their eyes off the screen. Additionally, the new system features a "Center Move" function that can move the mouse click point to the center of the display.

● Multi-functional and operator-friendly support

Shimadzu X-ray-SMX-1000L Plus Step Function

Stepping function, a feature for sequentially moving the loading platform at equal intervals for inspection. This function is used for inspecting samples of the same shape that can be arranged on trays and similar platforms.

· Teaching feature

The teaching function allows the sample stage to move to pre-set checkpoints for inspection. For mass inspections of similar samples, after logging the checkpoints, the stage can be quickly moved for inspection.

· Image Overview Feature

Saved images can be displayed as thumbnails in folders. This device's thumbnail display offers a rich set of features to provide strong support for the operator.

Standard measurement functions included

· Dimension Measurement

Including distance measurements between two points, angle, and curvature. Previously, size calibration was required for each image; now, the system links it with magnification, automatically calculating the calibration data for dimension measurements.

· BGA Bubble Rate Measurement

Once the critical value is set, click the measurement icon, and the system will automatically measure and display all holes on the image. The system can also automatically judge whether they meet the pre-set standards, and the measurement results can be saved in CSV format.

· Area Ratio Measurement

Used for measuring the wetting ratio of solder paste on welds or pads. The system measures the ratio of the target area within the ROI (User Area). The area ratio is the value of target area divided by ROI area.

Gold thread curvature measurement

Identify the ends of the gold wire and the points of the largest curvature, allowing the system to calculate the curvature of the gold wire accordingly. This measurement result can also be saved in CSV format.

Optional accessories

● VCT Components

Through this component (removable), a clear CONE CT image can be easily obtained.

VCT Component - Capacitance MPR Image

Rotating tilt component

This component allows for observation of small samples from all directions, eliminating blind spots.

Operation Box

This option utilizes a combination of an operating lever and buttons to manually control the movement of the loading platform, image zoom in/out, and rotation of the tilt components on the sample.