The uniformity of the non-uniform eccentric grinding path is significantly better than that of the fixed eccentric grinding path, which is beneficial for improving the surface shape accuracy of the workpiece. It is suitable for processing large-size workpieces with diameters greater than 200 mm and serves as a grinding polishing path for mass-produced mirror polishing machines.
According to the different relative movements between the workpiece and the processing disk, the polishing paths of the flat grinder include fixed eccentric grinding paths, uncertain eccentric grinding paths, linear grinding paths, oscillating grinding paths, square fractal grinding paths, and planetary grinding paths, among others.
Workpiece materials with fixed eccentric grinding paths exhibit poor uniformity in material removal. The closer to the center of the workpiece, the lower the material removal rate. Generally, they are used only for small workpieces with diameters not exceeding 200 mm. This is the case for high-precision grinding and polishing machines.
Linear grinding is not with a chuck, but with a flexible abrasive belt, where the workpiece performs a simple rotational movement. This is the cutting path of the self-sharpening mechanism on the abrasive plate of a flat grinding machine. This type of motion is simple, and if the abrasive belt is extended, it can enable batch production with high production efficiency.
Swing grinding paths are more uniform than those of fixed eccentric dual-axis or linear grinding. The path reveals several trends at the center of the machined surface, indicating a concave phenomenon at the center of the workpiece's machined surface.
The double-sided grinding machine commonly utilizes a planetary planar grinding trajectory. When the ratio of the grinding disc speed to the sun speed changes, both the work efficiency and the material removal rate will vary.
