Conductive silver paste is categorized into two types: 1) Polymer silver conductive paste (dried or cured into a film, using organic polymer as the bonding phase); 2) Sintered silver conductive paste (sintered into a film, sintering temperature >500°C, glass powder or oxide as the bonding phase). Silver powder is classified by particle size, with an average particle size <0.1μm (100nm) being nanosilver powder; 0.1μm < Dav (average particle size) < 10.0μm being coarse silver powder. There are many methods for preparing powder, and for silver, physical methods (plasma, atomization) and chemical methods (liquid phase reduction) can be used. Due to silver being a precious metal, it is easily reduced back to its elemental state, making liquid phase reduction the predominant method for silver powder preparation. This involves dissolving silver salts in water, adding a chemical reducer (such as hydrazine hydrate), precipitating silver powder, washing and drying to obtain silver reduced powder with an average particle size between 0.1-10.0μm. The choice of reducer, control of reaction conditions, and use of interface activators can produce silver micro-powders with different physical and chemical properties (particle shape, dispersion, average particle size, particle size distribution, specific surface area, bulk density, tapped density, grain size, crystallinity, etc.). Mechanical processing (ball milling, etc.) of the reduced powder yields bright silver powder and silver flake powder. The three categories that make up silver conductor paste (referred to as silver paste) require different types or combinations of silver powder as conductive fillers, and even different formulations within each category may necessitate different silver powders as conductive functional materials. The goal is to achieve maximum utilization of silver's conductivity and thermal conductivity with the least amount of silver powder under specific formulations or film-forming processes, which is crucial for optimizing film performance and cost. According to the use of silver powder in silver conductor paste, silver powders for the electronics industry are categorized into seven types: 1) High sintering activity silver powder for high-temperature sintered silver conductive paste; 2) High dispersion silver powder for high-temperature sintered silver conductive paste; 3) High conductivity reduced silver powder for electronic industry; 4) Bright silver powder; 5) Silver flake powder; 6) Nanosilver powder; 7) Coarse silver powder. Categories 1, 2, and 3 are collectively termed silver micro-powder (or reduced powder). The application of category 6 silver powder in silver conductor paste is still under exploration, while category 7 coarse silver powder is mainly used in silver alloys and other electrical applications.