Huan Guang Precision specializes in laser micro-cutting technology, with a research and development focus on breaking the monopoly of Japanese and German wafer semiconductor laser processing equipment. The market targets include mobile phones, in-car and security camera lenses, optical coating glass cutting, LED, silicon micro-cutting, and other fields. In 2022, we developed a laser equipment for diffraction gratings with no micro-cracks, filling the domestic wafer micro-cutting gap. We have 21 independent intellectual property rights, including 3 inventions; our product positioning is a series of silicon carbide invisible cutting equipment for applications in 3C diffraction gratings, LED, in-car autonomous driving, security, and new energy vehicle nano-film glass. The thick glass cutting, car coating glass de-molding equipment, and semiconductor equipment launched in recent years have gained recognition from industry clients worldwide.