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General Instrument Consumables & Inspection Services
Solar Energy/Semiconductors
Surface Analysis
Element Analysis


详情描述
Brook's non-contact accurate measurement for large-size workpiece machiningNPFlex 3D Surface Measurement SystemFlexible non-contact solutions for surface characterization measurements of large samples, widely applicable to the measurement of large, irregular parts in medical implants, aerospace, automotive, or machining. Based on the principle of white light interference, NPFlex provides users with greater data volume, higher resolution, and better repeatability than contact methods, making it a complementary measurement solution.
The open gantry design overcomes measurement difficulties caused by angles or orientations in some previous parts, now enabling NPFlex to achieve over 300 degrees of measurement space. The flexibility, data accuracy, and testing efficiency of NPFlex provide the processing industry with a simple method to meet its more stringent processing requirements, processes, and superior end products.
The Brook NPFLEX 3D Surface Measurement System offers a flexible non-contact solution for surface characterization measurement of large samples, exceeding 300 degrees of measurement space, overcoming the difficulties in measurement caused by certain angles or orientations of parts. The NPFLEX is designed for non-contact measurement of large, non-standard workpieces to obtain micrometer and millimeter-level surface morphology features.3D Surface Measurement System。
Its flexibility is demonstrated by its ability to measure larger surface shapes and more challenging angles.
· Space design allows for larger, more varied shapes of measurable parts (samples)
· Open gantry, custom fixtures, and optional swing measurement head for easy measurement of desired areas
3D Surface Information Measurement
Each measurement yields multiple analytical results.
· More measurement data can be easily obtained to assist in analysis
Vertical resolution up to nanometer level, offering more detail
· Intrude technology achieves sub-nanometer vertical resolution at each measurement pixel point
Quickly obtain measurement data, rapid testing process
· Shorter sample preparation and measurement preparation time
· A larger field of view (a surface) than contact measurement (a line) gathers more data from the surface










