详情描述

Silicon Wafer Surface Morphology Measurement VIT Series

NEW: Virtual Interface Technology for 3D-IC Metrology:

-TSV profile (depth, bottom CD, tilt, SWA)

-Residue Detection

-RST

-Copper Nail Height

-Bump Height and Cu pillar height

-Edge trim profile

3DIC TSV and BWS TTV Silicon Wafer Surface Morphology Measurement

Film Stress Film Tensile Tester

FEOL Electrical Characterization - Electrical Properties

Thin Wafer Metrology

Film Adhesion Testing: NEW - Virtual Interface Technology for 3D-IC Metrology

-TSV profile (depth, bottom CD, tilt, SWA)

-Residue Detection

-RST

-Copper Nail Height

-Bump Height and Cu pillar height

-Edge trim profile