Section 1: BGA Chip Removal
Ensure component protection during the disassembly of BGA ICs. Pay attention to whether it affects surrounding components, as some mobile phones have their font library, cache, and CPU very close. During soldering, place a wet cotton ball near the adjacent ICs. Many plastic amplifiers and soft-packaged font libraries have poor high-temperature resistance. The temperature during blowing should not be too high, otherwise, it's easy to damage them.
Apply an adequate amount of flux to the IC to be dismantled, and try to blow it into the bottom of the IC to help the solder points under the chip melt evenly.
Adjust the temperature and wind speed of the hot air, typically to 3-4 temperature settings and 2-3 wind speed settings. Move the nozzle about 3cm above the chip, heating until the solder balls beneath the chip are fully melted, then pick up the entire chip with a tweezer. Note: When heating the IC, blow around the IC's perimeter, not directly on the middle, as this may cause the IC to bulge. Avoid excessive heating time to prevent bubbles on the circuit board.
After removing the BGA chip, there is excess solder on both the chip pad and the PCB. Apply an adequate amount of flux to the circuit board, then remove the excess solder with a soldering iron. Optionally, solder slightly to make each pad smooth and round. Clean the flux from the chip and PCB with acetone, being particularly careful to avoid scraping off the green paint on the pads or causing them to detach.
(II) Tin-plating
Prepare for the task. Clean the solder from the IC surface thoroughly, apply a sufficient amount of flux to the BGA IC, remove excess solder with a soldering iron, then immerse the IC in acetone to clean it. After cleaning, inspect the IC solder joints for brightness. If there is oxidation, use a soldering iron with flux and solder to brighten them for soldering.
There are various methods for fixing BGA ICs. Here are two practical and convenient methods: Label Tape Fixing Method: Align the IC with the holes on the solder paste board, and use label tape to secure the IC to the board. Once aligned, hold the solder paste board steady with one hand or a tweezer, and then use the other hand to apply solder paste.
Under IC, place a few layers of napkin to secure: Place several layers of tissue paper under the IC, align the plated-through holes with the IC pins, press down firmly with your fingers or tweezers, and then scrape the solder paste.
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