Silicon wafers are the primary production material in the semiconductor and photovoltaic industries. The multi-wire saw technology for silicon wafer processing is the current global standard. It differs from traditional methods such as sawing and grinding, as well as from other laser and internal circular cutting techniques. The principle involves a high-speed moving steel wire, which drives a blade material attached to it against the silicon rod, achieving the cutting effect. Throughout the process, the wire is guided by several spindles, forming a web on the main spool. The workpiece to be processed is fed in by lowering the worktable. Compared to other technologies, the multi-wire saw technology for silicon wafers boasts high efficiency, production rates, and precision. It is currently the most widely used silicon wafer cutting technology.
The Multi-Line Cutting Machine technology represents a landmark innovation in the silicon processing and solar photovoltaic industries, replacing the traditional internal round cutting equipment. Compared to the internal round slicing technology, the wafers produced have the advantages of smaller BOW, WARP, better parallelism, smaller total thickness tolerance (TTA) dispersion, lower cutting edge loss, shallow surface damage layer, and smaller surface roughness.
The solar wafer cutting mechanism employs machine guide wheels to drive steel wires at high speeds, which transport mortar mixed with silicon carbide micropowder to the cutting area. The steel wires continuously rub and press against the workpieces on the wire mesh while spinning at high speeds, thereby completing the cutting process.
Throughout the entire multi-line cutting machine operation, factors such as the viscosity of the cutting fluid, the shape and particle size of silicon carbide powder, the viscosity of the mortar, the flow rate of the mortar, the speed of the wire, the tension of the wire, and the feed rate of the workpiece play a crucial role in the quality and yield of silicon wafers.
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