Common Issues in the Compression Process of Epoxy Boards_News Center Co., Ltd._Jiangsu Dongnan Glass Fiber Technology Co., Ltd. 
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Common Issues in the Compression Process of Epoxy Boards
Publish Time:2022-11-12        View Count:185        Return to List

Epoxy boards, a commonly used material, are made from materials such as epoxy resin and glass fiber fabric. They are a composite material that requires high-temperature pressing. During the production process, issues like surface blooming, blackening of the board core, and excessive glue on the surface may arise. This article will discuss the common problems encountered during the pressing process of epoxy boards and their solutions.

1. The surface exhibits floral patterns. The causes include uneven resin flow, moisture in the glass fabric, and overly long preheating time. Use resin with moderate fluidity and control the heating time accordingly.

2. The core is blackening and the edges are whitening. This is due to the excessive volatility of the resin, and the issue lies in the dipping glue step.

3. Surface Cracks. Thinner boards are more prone to this issue. Cracks can be caused by thermal stress, excessive pressure, or insufficient timing in applying pressure. The solution is to adjust the temperature and pressure.

4. Surface Gel. This often occurs in thick plates due to the large thickness of the material, slow heat transfer, leading to uneven resin flow.

5. Laminated Sheet Issues. This could be due to poor resin bonding or aged glass fabric, with the root cause being poor quality. The solution is to switch to high-quality raw materials.

6. Sheet Material Slippage. Excessive glue content can lead to this issue; the ratio of the adhesive solution is crucial.

7. Panel warping. Thermal expansion and contraction is a natural physical law; rapid changes in temperature can disrupt internal stresses and cause product deformation. During production, adequate time for heating and cooling should be ensured.

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