Characteristics and Applications of Epoxy Insulating Boards Explained:

1. Versatile options. Various resin, hardener, and modifier systems can accommodate a wide range of application requirements, extending from low viscosity to high melting point solids.

2. Solidification Convenience. With various different curing agents, the epoxy resin system can cure within a temperature range of 0～180℃.

3. Strong Adhesion. The presence of inherent polar hydroxyl groups and ether bonds in the epoxy resin molecular chains makes it highly adhesive to various materials. The low shrinkage during curing of epoxy resins results in minimal internal stress, which also contributes to enhanced adhesion strength.

4. Low shrinkage: The reaction between the epoxy resin and the curing agent is carried out through direct addition reactions or ring-opening polymerization of the epoxide groups in the resin molecules, without the release of water or other volatile by-products. Compared to unsaturated polyester resins and phenolic resins, they exhibit very low shrinkage (less than 2%) during the curing process.

5. Mechanical Properties. The cured epoxy resin system exhibits superior mechanical properties.