Motherboards, glass fiber boards, epoxy boards, and so on; they can also be further categorized into different models, with varying specifications among different insulating board wholesalers.

Insulating board processing requires specialized equipment. Here's an introduction to the insulating board processing technology.

Insulation board structure

Insulation pads should not have any harmful irregularities on their upper and lower surfaces, which are made from insulating materials. Harmful irregularities refer to any features that disrupt uniformity or damage the smooth contours of the surface, such as small holes, cracks, localized bulges, cuts, foreign conductive particles, creases, gaps, wavy patterns, and casting marks, among others. Harmless irregularities are surface irregularities formed during the production process.

Select five or more random points across the entire insulating board for thickness measurement and inspection. A micrometer or an instrument of equal precision can be used for measurement. The accuracy of the micrometer should be within 0.02mm. The diameter of the measuring drill should be 6mm, and the diameter of the flat pressure foot should be (3.17±0.25)mm. The pressure foot should be capable of exerting a pressure of (0.83±0.03)N. The insulating pad should be placed flat to ensure smoothness between micrometer measurements.

2. Insulation board inspection standards
①. Appearance
Scratch depth and height do not exceed the tolerance of the胶板thickness by 2mm. There should be no more than 5 bubbles per square meter with a diameter less than 1cm, and the distance between any two bubbles should be at least 40mm. Impurity depth and length do not exceed 1/64 of the胶板thickness. The unevenness or wave-like width of the edge should not exceed 10mm, and the length should not exceed 1/10 of the total length of the胶板. No cracks.

Insulation board hardness (Shore A)
55-703. Tensile Strength and Elongation at Break:
Tensile strength (Mpa) ≥ 5.02, Elongation at break ≥ 250%, 4. Tensile elongation (150%) deformation ≤ 25%, 5. Heat air aging (70℃ * 72h): Tensile strength reduction rate ≤ 30%, 6. Water absorption ≤ 1.5%.