In the field of electronic production, high demands are placed on tape. As is widely known, most tapes lose their adhesive strength under high temperatures. A new high-temperature-resistant tape, namely the masking tape, offers a better solution for the high-temperature baking production of electronic components.
Our bonding tape ensures no loosening or adhesive residue after 2 hours of exposure to high temperatures. The test materials include natural rubber, synthetic rubber, thermoplastic elastomers, curing agents, antioxidants, adhesive resins, solvents, and other optimized combinations. A certain proportion of solvents is added and evenly dispersed, then passed through a specialized coating machine and cured through high-temperature baking to produce high-temperature resistant pressure-sensitive tape, incorporating synthetic rubber, curing agents, accelerators, antioxidants, adhesive resins, etc. The progress of the tested product is advancing, with a tested formula combination showing advantages, as well as the test data of the product. The adhesion reaches 8N/25.4mm, with relevant chemical materials selected: natural rubber.
Utilizing 8mm pressure-sensitive adhesive tape on epoxy boards, the electronic components were subjected to a high-temperature treatment of 150 degrees Celsius for 2 hours. The tape securely adhered to the epoxy board without loosening or peeling off. Upon peeling the tape, there was no residual adhesive on the electronic components' wires. After two years of research and development, the product has gained continuous recognition in the market and has transitioned to factory production.
