Mask is a term used in integrated circuit manufacturing, typically referring to a mask that is reduced in size. The mask is produced by using an electron beam exposure system to directly transfer the pattern onto a mask sensitive to electron beams. The mask is composed of chrome-plated glass plates. The circuit pattern is first transferred onto the electron-sensitive mask, then onto the underlying chrome-plated layer, ultimately resulting in the required mask.

A graphic on a mask represents a layer in an integrated circuit design. The comprehensive layout and routing diagram is divided into several mask layers according to the corresponding processes in integrated circuit manufacturing, such as the isolation area being one layer, the gate area being another, and so on. Generally, a complete integrated circuit manufacturing process requires 15 to 20 different mask layers.

High Precision High Temperature Hot Plates Mask Substrate Heating Station High Accuracy Bake Glue Machine Gluing PlatformPerformance

Heating mat sizes: 160*160/220*220/350*350, customizable

Temperature Resolution: 0.1℃

Temperature fluctuation: ≤±0.5℃

Uniformity of temperature: ≤±0.5%℃

Temperature Range: RT+5-200/350/450/600℃

Customizable Functions: Vacuum/PIN/Filling with Nitrogen/Programmed Baking, etc.

Heated plate surface treated with anodizing, offering enhanced corrosion resistance, greater scratch resistance, and superior texture.

Utilizing high thermal conductivity aluminum alloy sheets, the disk features excellent uniform temperature performance and does not deform under prolonged high temperatures.

Precision machining, one-piece molding, ensuring high flatness of the disk surface.

Utilizing high-performance electric heating tubes for heating, it achieves quick temperature rise, high thermal efficiency, extended lifespan, and easy maintenance.

The housing is made of stainless steel, offering both aesthetic appeal and durability, slow heat transfer, and easy maintenance.

Precision High-Temperature Hot Plate Mask Substrate Heater High-Precision Soldering Paste Oven Paste Heating PlatformUsage

Precision High-Temperature Heat Plate   Mask Heater   High-Precision Bake Glue Machine   Glue烘烤 PlatformApplicable to processes such as surface coating after photoresist, film drying, and curing on substrates like semiconductor silicon wafers, glass slides, chips, substrates, and ITO conductive glass. This includes curing photoresist, curing epoxy resins, masking film baking, flexible circuit testing, wearable technology sensor calibration, and placing in a glove box. Suitable for pre-baking and hardening in photolithography processes, as well as for coating, sintering, and inspection of circuit modules.