Vacuum Oxygen-Free Oven / Oxidation-Free Vacuum Drying Oven / High-Temperature Oxygen-Free PI Vacuum Drying Oven - Industry Applications
Vacuum oxygen-free ovens are used for processes such as photoresist BCB curing, polyimide PI/CPI curing, BPO curing, LCP fiber heat treatment, wafer drying and baking, primarily for industries related to integrated circuits, compound semiconductors, MEMS microelectromechanical systems, TFT/LCD, and other semiconductor applications.
Compatibility: 2" to 12" fragments compatible.
Low oxygen concentration: Vacuum curing can be achieved under 20 PPM oxygen.
Low energy consumption, vacuum state curing, saving 80% of N₂ volume.
Non-toxic; all internal materials of the cavity are made of 316L stainless steel, no particles generated.
Vacuum Oxygen-Free Oven | Oxygen-Free Vacuum Dryer | High-Temperature Oxygen-Free P.I. Vacuum Dryer Performance
Temperature: RT-400/500°C
Vacuum Level: Less than 1 torr
Operation: True Color Human-Machine Interface, One-Touch Operation
Cooling Method: Water Cooling + Air Cooling
Air Lines: 2 Lines of N2
Program Mode: 10 programs running, each program can be set up to 25 steps
Insulating Material: Ceramic Fiber
Work腔: 40-800L options available
Vacuum Oxygen-Free Oven Oxygen-Free Vacuum Dryer High-Temperature Oxygen-Free PI Vacuum Drying ProcessRequirements：
Reduce the oxygen concentration in the cavity
Vacuum and then heat up linearly to 1xx°C, maintain temperature for a certain period
Ramp up to 1xx°C and hold for approximately 60 minutes.
Continue heating to x00°C, with a heating time of 10-x0 minutes depending on the coating thickness.
Retains heat for approximately 60 minutes.
Cool down to below 100℃
Nitrogen-filled pressure return door
