100-Grade Nitrogen Firing Oven, Mask Filling Dust-Free Oven, Semiconductor High-Temperature Clean Oven, Process Usage

During the production of mask blanks, after the photoresist coating, there is a baking process known as pre-baking. The purpose is to remove excess solvents from the photoresist on the mask blank using heat evaporation, enhance the adhesion between the photoresist and the mask blank substrate, and solidify the photoresist. Additionally, the mask blank coated with photoresist also requires post-exposure baking after development, aimed at removing excess moisture, residual solvents, and eliminating standing wave effects.

Mask blank manufacturing process, including the following steps: S1, Coating: Provide an optical high molecular PC composite plate, spin-coat an anti-reflective neutral adherent layer on the surface of the optical high molecular PC composite plate, and then spin-coat a neutral UV photoresist on the anti-reflective neutral adherent layer; S2, Photolithography: Use a direct write photolithography mask machine to expose the neutral UV photoresist with a laser; S3, Development: Place the photolithographed optical high molecular PC composite plate in a development槽 for immersion development, where a developer solution is present; S4, Hardening.

100-Grade Nitrogen Drying Oven  Mask Plate Dust-Free Drying Oven  Semiconductor High-Temperature Clean Drying Oven  Performance

Full-week laser welding, SUS304# stainless steel electric heater, dust-proof for the machine itself to generate fine dust.

Utilizes special air ducts for horizontal air distribution, ensuring excellent temperature uniformity.

Programmable for single-value operation and multi-segment program execution.

The equipment features an integrated dual-chamber design with independent control, saving space.

Temperature Range: RT+10～200, 300/400℃

Temperature Uniformity: ≤±1.5℃

Cleanliness: Class 100/1000, suitable for cleanroom.

Equipment Dimensions: Customized

Timer Function: adjustable from 0~99H99M, temperature-arrival timing, buzzer and heating stop upon completion of timing.

Cooling Methods: Optional

Insulation Material: Ultra-fine Ceramic Fiber

Dividers: 1-10 layers;

Temperature Measurement Sensor: High-Precision Platinum Resistance Sensor

100-Level Nitrogen Bake Oven Mask Blending Dust-Free Bake Oven Semiconductor High Temperature Cleanroom Bake Oven Manufacturer