Oxygen-Free Curing Furnace  High-Temperature Oxygen-Free Curing Oven  JS-GYM125 Dust-Free Oxygen-Free Drying OvenBulk production for semiconductor wafers, semiconductor packaging, and MEMS devices. Primarily used for PI/CPI curing, BCB curing, PBO curing, and LCP fiber heat treatment.

Aerobic Curing Furnace  High-Temperature Oxygen-Free Curing Oven  JS-GYM125 Dust-Free Oxygen-Free Drying OvenBasic Principle

We will now step-by-step introduce the working principle of the curing furnace:

The implementation of high-temperature functionality involves heating the furnace cavity. The heating system of a curing furnace typically consists of several heaters and a temperature controller. Firstly, the heaters emit heat to circulate the gas heat within the oven, gradually increasing the temperature inside the furnace cavity. Then, the temperature controller regulates the amount of heat output, controlling the temperature inside the chamber.

Second: To achieve low oxygen concentration, gas displacement is employed. The curing furnace chamber is a sealed space, where inert gases like N2 are introduced into the chamber through the intake. After circulating within the chamber, the air and mixed gases are expelled through the exhaust port (the vacuum oxygen-free oven can first be evacuated and then nitrogen-filled for multiple cycles), thereby reducing the oxygen concentration inside the chamber.

Third: Oxygen-Free Curing Furnace, High-Temperature Oxygen-Free Curing Furnace Structure:

Case Structure: The inner box is made of SUS304/316L stainless steel and features seamless argon arc welding; the outer box is made of high-quality stainless steel or cold-rolled steel with electrostatic powder coating; the insulation material of the outer box is an advanced ultra-fine ceramic fiber, providing six-sided heat insulation and thermal break, aimed at reducing the surface temperature of the machine.

Anaerobic Curing Furnace, High-Temperature Non-Oxidation Curing Oven, JS-GYM125 Dust-Free Non-Oxidation OvenPerformance:

Temperature Range: RT-350/450/550°F

Vacuum Level: Less than 100 Pa

Operation Interface: Colorful Human-Machine Interface, One-Click Operation

Cooling Method: Water Cooling + Air Cooling

Air Lines: 2-3 N2 Lines

Program Mode: 5-10 programs can be run, with each program set to 25 steps

Oxygen content: 10 ppm

Operation Tone: 1/2/4/8 options available

Internal Volume: 500*500*550mm, Customized