PI Amine Anaerobic Furnace PI Vacuum Anaerobic Oven High-Temperature Oxygen-Free PI Oven PI Oven
PI curing ovens are used for processes such as photoresist BCB, polyimide PI/CPI curing, LCP fiber heat treatment, wafer drying and baking, etc., mainly for industries related to integrated circuits, compound semiconductors, MEMS microelectromechanical systems, TFT/LCD, and other semiconductor fields.
Versatile, fully automatic vacuum curing, compatible with 2-inch to 12-inch/fragment sizes.
Strong guarantee, vacuum curing can be achieved under 5PPM oxygen.
Timeliness, multi-functional cooling methods, reduced process time, cost reduction, and increased production capacity.
Low energy consumption, vacuum state curing, saving 80% of N₂ volume.
Non-toxic; all materials inside the cavity are made of 316L stainless steel, no particles are produced.
PI Ammonium Anaerobic Furnace PI Vacuum Anaerobic Oven High-Temperature Oxygen-Free PI Oven PI Oven
Temperature: RT-350/450°C
Vacuum Degree: Below 100 Pa
Operation: Colorful human-machine interface, one-touch operation
Cooling Method: Water Cooling + Air Cooling
Air Lines: 2 Lines of N2
Program Mode: 10 programs running, each with 25 steps adjustable
Insulation Material: Ceramic Fiber
Working cavity: 1/2/4/8 options available
PI Anaerobic Furnace, PI Vacuum Anaerobic Oven, High-Temperature Oxygen-Free PI Oven, PI Oven(Reference):
In a low-oxygen environment
Vacuum heating,升温to 1xx℃
Rerheat to 1xx℃ (approx. xh), then hold at temperature for about 30min.
Continue heating to x00°C, with a heating time of 10-x0 minutes depending on the coating thickness.
Insulation time: approximately 60 minutes
Cool down to below 100℃
