Cleanroom Oxygen-Free Oven   PI/BCB/PBO Oxygen-Free Oven   High-Temperature Anaerobic Oven Application in Wafer-Level Packaging Process

Wafer-Level Packaging Process Flow

1. Coating polymer film to reinforce the chip's passivation layer, serving as a stress buffer. Polymer types include photosensitive polyimide (PI), benzocyclobutene (BCB), and polybenzoxazole (PBO).

2. The Reballing Dielectric Layer (RDL) involves repositioning the aluminum/copper bonding areas on the chip to meet the minimum spacing requirements for solder ball placement and to arrange the new bonding areas in an array pattern. Photoresist acts as a template for selective electroplating to plan the RDL's routing patterns, and is eventually removed along with the sputtering layer through wet etching.

3. Apply the second layer of polymer film to flatten the wafer surface and protect the RDL layer. Photolithographically define new soldering area locations on the second layer polymer film.

4. The Under-Bump Metal (UBM) features the same process flow as the RDL.

5. Solder Ball Placement. Solder paste and solder balls are accurately positioned via a mask. The solder balls are placed on the UBM and then inserted into a reflow oven. The solder melts and wets well with the UBM, achieving excellent welding results.

 A dust-free and oxygen-free oven is essential production equipment during the curing process of PI/BCB/PBO polymer in the above polymer film technology.

Cleanroom Oxygen-Free Oven  PI/BCB/PBO Oxygen-Free Oven  Technical Requirements for High-Temperature Anaerobic Oven

Temperature Range: RT+50 ~ 350/450/550°C

Studio Size (cm): W50×D50×H50; Customizable

Oxygen content specification: ≤ 50ppm, real-time detection

Cleanliness: Class 100/1000

Thermal Control Method: Curve Heating Mode

Temperature Control Sections: Multi-section, multi-process

Nitrogen Control: Adjustable nitrogen flowmeter, continuous nitrogen supply.

Auxiliary Cooling: Air-cooled/Water-cooled rapid cooling devices

Vacuum Dust-Free Oxygen-Free Drying Oven

Temperature Range: RT+50 to 350/450/550°C

Studio Size (cm): W50×D50×H50; Customizable

Oxygen Content Specification: ≤ 50ppm, Real-time Detection

Cleanliness: Class 100/1000

Temperature Control Method: Curve Heating Mode

Temperature Control Sections: Multiple stages, various processes.

Nitrogen Control: Adjustable nitrogen flow meter, continuous nitrogen supply.

Auxiliary Cooling: Air-cooled/Water-cooled rapid cooling devices

Vacuum Level: 1 torr

Vacuum Pump: Oil-Free Scroll Pump

Cleanroom Oxygen-Free Oven  PI/BCB/PBO Oxygen-Free Oven  High-Temperature Anaerobic Oven