PI Oxygen-Free Drying Oven Process, PI Dust-Free Oxygen-Free Furnace, High-Temperature Oxygen-Free BCB Vacuum Drying Oven Process
PI photoresist is a high-performance, high-precision photoresist widely used in microelectronics, optoelectronics, and MEMS fields.
PI Oxygen-Free Oven Process, PI Dust-Free Oxygen-Free Furnace, The Necessity of High-Temperature Oxygen-Free BCB Vacuum Oven Process：
Pre-baking of PI photoresist involves applying it to the substrate and then drying it for a period at a specific temperature to evaporate the solvent in the PI solution, forming a certain network structure and enhancing its adhesion. Oxygen-free ovens are used in industries such as semiconductor, electronics, new materials, and new energy. They are used for curing BCB, PI, PBO resins, heat treatment of LCP new materials, lithium batteries, and other products.
PI Oxygen-Free Oven Process, PI Dust-Free Oxygen-Free Oven, High-Temperature Oxygen-Free BCB Vacuum Oven ProcessRequirements(Reference):
Operate under low-oxygen conditions
Vacuum heating,升温to 1xx℃
Reheat to 1xx°C (approx. xh), hold for about 30min.
Continue heating to x00°C, with heating time of 10-x0 minutes depending on the coating thickness.
Insulation for about 60 minutes.
Cool down to below 100℃
PI Oxygen-Free Drying Oven Process PI Dust-Free Oxygen-Free Oven High-Temperature Oxygen-Free BCB Vacuum Drying OvenPerformance：
Temperature: Room temperature +50～400℃
Oxygen Concentration: ≤10ppm
Vacuum Level: 1 Torr
Cooling Unit: Auxiliary Temperature Reduction
Control Method: Programmable Operation
Anaerobic ovens, vacuum anaerobic ovens, dust-free ovens, HMDS ovens, sputtering machines, dust-free anaerobic ovens, nitrogen ovens, blowing vacuum ovens, ultra-low temperature test chambers, rapid temperature change test chambers, constant temperature and humidity test chambers, high and low temperature shock test chambers, and more equipment, along with custom solutions. --- Shanghai Junsi Instruments, specializing in production and service!
