PI Vacuum Oven, Oxygen-Free PI Oven, High-Temperature Oxygen-Free Oven, BCB Oxygen-Free Oven_供应产品_Shanghai Junsi Experimental Instrument Co., Ltd.

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Home > 供应产品 > PI Vacuum Oven, Oxygen-Free PI Oven, High-Temperature Oxygen-Free Oven, BCB Oxygen-Free Oven
PI Vacuum Oven, Oxygen-Free PI Oven, High-Temperature Oxygen-Free Oven, BCB Oxygen-Free Oven
品牌: Junsight
Is import required?:
Origin: Shanghai
Custom Processing: Is
单价: 0.01/Set
最小起订Quantity: 1 Set
供货总Quantity: 969588 Set
有效期至: 长期有效
最后更新: 2025-06-26 13:14
 
详细Info

PI Vacuum Oven, Oxygen-Free PI Oven, High-Temperature Oxygen-Free Bake Oven, BCB Oxygen-Free OvenThe Application

The PI vacuum oven is used for batch production of semiconductor wafers, semiconductor packaging, and MEMS devices. Mainly used for PI curing, BCB curing, PBO curing, and LCP fiber heat treatment.

Operating under vacuum reduces the vapor pressure of moisture in the space, accelerating the drying process, and lowers the boiling point of moisture and the drying temperature of the material. Steam is less likely to leak out, thus making vacuum high-temperature oxygen-free ovens suitable for drying heat-sensitive, easily oxidizable, explosive, and toxic materials, as well as for situations where moisture vapor needs to be recovered.

PI Vacuum Oven, Oxygen-Free PI Oven, High-Temperature Oxygen-Free Drying Oven, BCB Oxygen-Free OvenTechnical Performance:

Temperature Range: Room Temperature +50 to 400/500°C

Temperature Regulation Accuracy: ±1.0℃

Rise Rate: 1~8℃/m, adjustable

Cooling Time: 350-90℃ ≤ 90min

Oxygen Concentration: ≤10ppm

Oxygen Concentration Arrival Time: ≤ 25 minutes

Packaging: 316L stainless steel plate

Outer packaging: Cold-rolled steel sheet, surface with durable coating

Insulation Material: Ceramic Fiber

Cooling System: Water Cooling + Air Cooling

Temperature Control Method: PID Control

Operation Interface: Liquid Crystal Touch Screen + PLC

Operation Functions: Manual Setpoint Operation, Automatic Program Operation

Program Mode: 10 programs running, each program can be set with 25 steps

PI Vacuum Oven, Oxygen-Free PI Furnace, High-Temperature Oxidation-Free Oven, BCB Oxygen-Free Furnace Features

Fully automatic vacuum curing, one-touch operation, no need for manual supervision

10 PPM low oxygen level, vacuum curing under low pressure.

Cavity airflow design enhances cavity cleanliness and significantly reduces N₂ consumption.

Uniform temperature control ensures high wafer temperature uniformity.

Rapid heating and cooling capabilities to minimize processing wait times.

All materials for the inner cavity are made of 316L stainless steel.



询价单


18016281599