OAP Vacuum Oven  OAP Process Treatment Oven  Intelligent HMDS OvenOur manufacturing process

The role of photolithography is to convert various shapes from a mask onto the device structure of a wafer. It plays a decisive role in the formation of integrated circuit graphic structures, such as the shapes of various thin film layers and doping regions. In the basic process steps of photolithography, the pretreatment step involves changing the hydrophilicity of the wafer to hydrophobicity, i.e., the OAP (HMDS pretreatment) process.

OAP Vacuum Oven, OAP Process Treatment Oven, HMDS Smart Oven Overview

OAP processes ovens, also known as HMDS ovens or HMDS pretreatment systems. Surface treatment is achieved using HMDS solution (hexamethyl disilazane) to form a base film, which enhances adhesion. The coating is applied as soon as possible after the base film operation on the silicon wafers. The OAP oven completes the HMDS coating process through gas-phase base film formation, offering the advantage of being an enclosed environment where the silicon wafers are not exposed to the outside, reducing the possibility of contamination from liquid HMDS particles, and with a lower consumption of HMDS.

OAP Vacuum Oven  OAP Process Treatment Oven  Intelligent HMDS Oven Specifications

HMDS Leak Alarm Alert Feature

HMDS Low Liquid Level Alarm Function

Process Data Recording Function

HMDS Pipeline Preheating Function

Program Lock Protection Features

Dimensions (Depth x Width x Height)

Internal腔 dimensions: 450×450×450 mm (Customizable)

Material: The outer case is made of high-quality cold-rolled steel with powder coating, while the inner case is constructed from 316L grade stainless steel.

Temperature Range: RT+50-200℃

Temperature Fluctuation: ≤±0.5

Vacuum Level: ≤1 torr

HMDS Control: HMDS addition amount controllable

Oil-Free Scroll Vacuum Pump