LCP Film-Specific High-Temperature Oxygen-Free Oven, LCP Vacuum Oven, LCP Spinning Oven

LCP film boasts low dielectric constant, low dielectric loss, low water absorption, and stable performance, making it an ideal high-frequency, high-speed FCCL substrate for 5G. It is widely used in 5G mobile phone antennas, camera flex boards, laptop high-speed transmission lines, and smartwatch antennas.

The selection of antenna materials for 5G smartphones involves not only excellent performance but also significant cost considerations. LCP, due to its higher cost, has discouraged many smartphone manufacturers. The current industry bottleneck lies in: the LCP film resin and how to produce it into a thin film product. LCP thin films require thickness organization reorganization and complementary heat treatment optimization.LCP Film-Specific High-Temperature Oxygen-Free OvenTo meet performance requirements under high-frequency and high-speed service environments.

LCP Film-Specific High-Temperature Oxygen-Free Drying Oven  LCP Vacuum Drying Oven  LCP Spinning Drying Oven Introduction
Oxygen-free vacuum ovens are used for curing PI and BCB resins, LCP heat treatment, bonding material pretreatment, ITO film annealing, PR adhesive dispensing and curing, and other special processes. Suitable for electronic LCD displays, LCDs, CMOS, ICs, PCBs, semiconductor packaging, and laboratory production and research departments.
LCP Film-Specific High-Temperature Oxygen-Free Drying Oven, LCP Vacuum Drying Oven, LCP Spinning Drying Oven Technical Specifications
Temperature Range: RT ~ 400℃
Temperature fluctuation: ≤±1℃
Rising Temperature Rate: 0-10℃/min
Oxygen content detection: 20ppm
Working Dimensions: Customized

Cooling Methods: Auxiliary Cooling
Exhaust Ports: 2
Vacuum Pump: Vortex Dry Pump