Moisture-Sensitive Film Oxygen-Free Drying Oven, New Material Anti-Oxidation Drying Oven, Adhesive Film Material Oxygen-Free Drying Oven
Manufacturing humidity sensors on polyimide (polymide, PI) flexible substrates, PI is a common material for flexible sensor substrates with advantages such as stable chemical properties, high-temperature resistance, and good bonding with electrode materials. The processing method involves depositing a polyamide suspension onto a carrier silicon wafer prepared with a sacrificial layer, and using MEMS technology to fabricate the humidity-sensitive unit. The humidity sensors produced in this study feature a "sandwich" structure, including an upper electrode, a moisture-sensing layer, and a lower electrode, with both electrodes utilizing sputtering technology, using sputtered gold as the electrode; the moisture-sensing film is made of polyimide material and is prepared using the spinning coating method.
Manufacturing Hygroscopic Film: Spin-coat the polyimide precursor prepolymer polyamide onto the substrate, then placeHigh-Temperature Oxygen-Free OvenAt 100℃ for 30 minutes, then increase the temperature at a rate of 5℃/min to 150-180℃ and hold for 30 minutes; further increase the temperature at 5℃/min to 220-250℃ and hold for 30 minutes; then increase the temperature at 5℃/min to 280-300℃ and hold for 1 hour, finally reaching 350-380℃ and holding for 1 hour. Cool down at a rate of 3-8℃/min to 50-100℃ to complete the curing of the polyimide hygroscopic material, with a hygroscopic film thickness of 2μm.
Moisture-Sensitive Film Oxygen-Free Oven, New Material Anti-Oxidation Oven, Adhesive Film Material Oxygen-Free Bake Oven
Studio Size:W500mm x 500mm x H500mm. Customizable.
Temperature Range: RT+50～450℃
Resolution: 0.1℃
Variance: ≤±1℃
Uniformity of temperature: ≤±1.5%℃
Cleanliness: Class 100/Class 1000
Rising Rate: 1~10℃/min
Cooling Rate: High temperature cooling to 80°C at an average of 4.0°C/min
Oxygen Content: ≤20ppm
Operation Method: Human-Machine Interface + PLC, one-button operation for programming, multiple processes can be saved.
Shanghai Junsi specializes in providing baking process equipment and temperature detection instruments.HMDS Oven, Intelligent HMDS Vacuum System, Anti-adhesive Coating Machine, High-Precision Constant Temperature Heating Platform, High-Temperature Oxygen-Free OvenPI Ovens, Nitrogen Ovens, MSD Ovens, Low Temperature and Low Humidity Ovens, Cleanroom Ovens, Dust-Free Ovens, High Temperature Dust-Free Oxygen-Free Ovens, Vacuum Oxygen-Free Ovens, Plasma Cleaners, RTP Rapid Annealing Furnaces, Desktop High and Low Temperature Test Chambers, High and Low Temperature Shock Test Chambers, Constant Temperature and Humidity Test Chambers, Ultra-Low Temperature Test Chambers, etc.Equipment.
Moisture-Sensitive Film Oxygen-Free Drying Oven, New Material Protection
Oxidation Oven - Dental GumOxygen-Free Sintering Furnace for Customized Sheet Material
