Wafer Cleanroom Oven, Stainless Steel 100 Class Oven, Photoresist Hardening OvenTechnical Specifications

 Inner Box Material:SUS304 mirror-polished stainless steel

Outer Carton Material: High-quality cold-rolled steel with plastic coating.

Dust-Free Rating: Class 100

Temperature Range:RT+10～250℃；
Uniformity of temperature: ≤±1.5%;    

Temperature Fluctuation: ±0.5℃ (No Load)；        
Temperature Control Accuracy: ±0.1℃

Air Inlet:φ8mmN2IntakeTrafficPlease provide the Chinese content you would like translated.Control;  

Exhaust vent：φ100mmExhaust ventilationTubing;

WorkRoomDimensions:W675×L860×H600（mm）；    
Power Supply:380v/50Hz，8.5KW；  

Mesh Plate:2-9 layers；

Purity：class100 Grade

Wafer Cleanroom Oven, Stainless Steel 100 Class Oven, Photoresist Hardening Oven Temperature Controller:

1. 4.3-inch color touch screen

2. Two control modes: Setpoint/Programmed

3. Sensor Type: PT100

4. Alarm Signals: 16 alarm inputs (DI) with editable names.

5. Temperature Measurement Range: -20.00℃ to 400.00℃ ( customizable ); ±0.3℃ accuracy.

6. Interface Language Types: Chinese/English

7. Communication Interface: RS232/RS485

8. Program Editing: Capable of programming 120 sets of programs, with each program consisting of 100 segments.

Clean Drying OvenBaiGrade A clean ovens are used for pre-treatment baking before coating on silicon wafers, niobium lithium, glass, and other materials in semiconductor manufacturing; for hardening baking after coating and high-temperature baking after development; also suitable for production and research departments in electronic liquid crystal displays, LCDs, CMOS, IS, and laboratories; and can also be used for drying, heat treatment, aging, and other high-temperature tests for non-volatile and non-flammable, non-explosive items.