Nitrogen Clean Oven, Photoresist Dust-Free Oven, Pre-Bake Nitrogen Oven, Class 100 Oven Process

Different spin speeds correspond to different photoresist thicknesses. The thicker the thickness, the lower the resolution of the photolithography due to the penetration depth of exposure and the diffraction of light, and a distinct trapezoidal shape will form on the side walls of the photoresist. If the thickness is too thin, it can be etched through during the etching process. Choose an appropriate photoresist thickness based on the required etching depth, and thus select the suitable spin speed.

After even coating, bake at 95° for 5 minutes to enhance the density and adhesion of the photoresist to the wafer.

Nitrogen Clean Drying Oven, Photoresist Dust-Free Oven, Pre-Drying Nitrogen Oven, 100 Class Oven Specifications

Cleanliness: Class 100, 1000

Temperature: RT +15 to 200/300/400°C
Gas: N2

Timer function: Optional

Material: Internal SUS304 stainless steel

Working Dimensions (mm):

450×450×500

500×500×550

600×700×800

( customizable )

Mold Plates: 2-5 movable

Operating Mode: Setpoint or Programmed

Operation Interface: Keypad or Color Touch Screen

Nitrogen Cleanliness Oven, Photoresist Dust-Free Oven, Pre-Drying Nitrogen Oven, 100-Class Oven Application

Suitable for IC packaging, photoresist curing, silver adhesive curing, electronic liquid crystal display, LCD, CMOS, MEMS, and laboratory production and research.