Laser engraving machines use laser beams to remove specific metal parts, achieving the desired effect or identification. Laser metal engraving is divided into shallow engraving and deep engraving. Generally, the depth of engraving is related to factors such as the material's absorption of the laser, the laser power, and the duration of the laser's effect on the material. Shallow engraving is primarily used for marking various tools and components with durable identification. Deep engraving is typically used for雕刻 tools and seals, often requiring a longer duration of exposure. Both deep and shallow engraving can be performed on various metal surfaces, such as雕刻 identification codes, company logos, and more complex images.
1. Capable of processing various metals and non-metallic materials. Particularly advantageous in marking high-hardness, high-melting point, and brittle materials.
2. Ideal for contact-free processing, product damage-free, zero tool wear, and high-quality marking.
3. Fine laser beam, minimal material consumption during processing, and small heat-affected zone.
4. High processing efficiency, computer-controlled, and easy to automate.
Broadly applicable to graphic and textual marking for various fields such as integrated circuit chips, computer accessories, industrial bearings, watches, electronic and communication products, aerospace components, various auto parts, home appliances, hardware tools, molds, wires and cables, food packaging, jewelry, and mass production line operations.
Feature Model: HLL-30W
Laser Output Power: ≤30W
Laser Wavelength: 1064nm
Beam Quality M2: <1.8
Laser Q-switching Frequency: 20kHz ~ 80kHz
Standard Engraving Range: 110mm x 110mm
Available Engraving Range: 70mm x 70mm / 150mm x 150mm
Engraving Depth: ≤2mm
Total Power: 800W
Line Width: 0.01mm
Repeatability: ±0.0001mm
Power Requirement: Single-phase AC 90-250V/50Hz, 10A
Engraving Speed: 800 characters/s (single-line Roman font height 1mm)
Mainframe system dimensions: 800mm x 680mm x 1200mm
Cooling System: Air-cooled
