The ultraviolet laser cutting machine can achieve precise cuts on flexible circuit boards and organic cover films without the need for special pressure or mold fixation. Utilizing a galvanometer scanner and a linear motor two-axis table in a combined motion, it does not increase processing difficulty due to complex shapes or winding paths; the MicroVector equipment uses vector descriptions for the laser path, resulting in a smoother cut.

The laser system produces perfectly rounded, smooth edges on the covering film, free of burrs and excess glue. When windows are cut using machining methods like molds, it's inevitable that there will be burrs and excess glue around the window edges, which are difficult to remove after the film is bonded and焊接 onto the pads, directly affecting the quality of the subsequent coating. What are the main technical parameters of the UV laser cutting machine?

Laser: Solid-state Laser

Laser Material: Nd:YVO4

Laser Wavelength: 355nm

Rated Power: 7W @ 25KHz

Linear Motor Workbench Positioning Accuracy: +/-2μm

Linear Motor Worktable Repeating Accuracy: +/-1μm

Linear Motor Worktable Effective Travel: 304mm x 400mm

CCD Automatic Positioning Accuracy: 7μm

Mirror Working Area: 40mm x 40mm

Repeatability of Shutter Mirror: +/-2μm

Data Files: Gerber Standard Format, DXF, PLT

Cutting Thickness: 1mm, 6-layer Plyboard

Line Width: 30um

Cutting Speed: 200mm/s