SMT

Surface mount technology

Surface mount technology, a more traditional installation method. Its advantages include high reliability, but it has the drawbacks of being large in size, high in cost, and limiting the miniaturization of LCMs.

COB

Chip On Board

Once the chips are bonded onto the PCB, due to the IC manufacturer in LCD control and related

Production of QFP (a type of SMT packaging) is decreasing, so traditional SMT methods will be gradually replaced in future products.

TAB

Tape Aotomated Bonding

Anisotropic Conductive Adhesive Connection Method. Encapsulation in TCP (Tape Carrier Package) format.

ICs (Integrated Circuits) are fixed on the LCD and PCB using anisotropic conductive adhesives in a packaging method. This installation method reduces the weight and volume of the LCM (Liquid Crystal Module), is easy to install, and offers good reliability!

COGChip On Glass

Chips are directly bonded onto glass. This installation method significantly reduces the overall size of the LCD module and is conducive to mass production, making it suitable for LCDs used in consumer electronics like smartphones and PDAs. Driven by IC manufacturers, this bonding technique is poised to become the primary connection method between ICs and LCDs in the future.

COF

Chip On Film

Chips are directly mounted onto flexible PCBs. This method offers a high level of integration, allowing peripheral components to be installed alongside the ICs on the flexible PCB. It's an emerging technology that has now entered the trial production phase.