Every industry has its trusty equipment assistants, and today we're diving into the rising star of the electronics industry: "X-ray inspection equipment." Those who work in this field are undoubtedly familiar with it. This article summarizes the principles and application areas of X-ray inspection equipment, allowing readers to grasp the essentials quickly.
The X-RAY equipment primarily utilizes the penetrating power of X-ray radiation. With extremely short wavelengths and high energy, when照射 on matter, only a small portion is absorbed, while the majority of the X-ray energy passes through the gaps between atoms, demonstrating strong penetration capabilities.
The x-ray equipment detects by utilizing the penetration power of X-ray radiation and its relationship with material density. By distinguishing between the varying absorption of this property, materials with different densities can be differentiated. Therefore, if the item being inspected shows cracks, uneven thickness, or a change in shape, the absorption of X-ray radiation differs, resulting in different images, hence generating differentiated black and white images.
3. Suitable for IGBT semiconductor testing, BGA chip testing, LED strip testing, PCB bare board testing, lithium battery testing, and non-destructive testing of aluminum castings.
4. Simply put, it is through the use of non-destructive micro-focus X-ray equipment to output high-quality fluorescence透视 images, which are then converted into signals received by the flat panel detector. All functions can be operated with just a mouse, making it extremely user-friendly. The high-performance X-ray tube can detect defects below 5 micrometers, with some X-ray equipment capable of detecting below 2.5 micrometers. The system's magnification can reach up to 1000 times, and objects can be moved and tilted. The X-ray equipment allows for manual or automatic inspections, and automatically generates inspection data reports.
Application of X-Ray Inspection Equipment
The X-RAY detection equipment for industry has a wide range of applications, commonly used in battery industries such as lithium battery testing, circuit board manufacturing, semiconductor packaging, automotive industry, and PCBA (Printed Circuit Board Assembly) industry. It is used to observe and measure the position and shape of internal objects after packaging, identify issues, confirm product qualification, and inspect internal conditions.
2. Detailed Application Scope: Primarily used for SMT, LED, BGA, CSP flip-chip component inspection, semiconductor, packaging components, lithium battery industry, electronic components, automotive parts, photovoltaic industry, aluminum die casting, mold injection plastics, ceramic products, and other special industry inspections.
