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Home > News Center Co., Ltd. > Raw material curing temperature for transformer frame
News Center Co., Ltd.
Raw material curing temperature for transformer frame
Publish Time:2024-07-12        View Count:12        Return to List

Transformer frame design requires attention to several aspects:

Transformer models must be met, with the physical dimensions smaller than the finished transformer size. Metal pins should be able to pass through or lay flat on the client's PCB board, with iron (steel) pins generally being more commonly used. When the client has special requirements for pins with better conductivity, materials like copper with good conductivity should be considered. The raw materials must comply with the client's process and requirements, and it is essential to design the frame according to the characteristics of the material. Generally, the confirmation of the frame wall thickness is referred to the yellow card.

In conjunction with the temperature displayed on the yellow card, compare it with the baking and soldering temperatures of the customer's process to determine if it meets the customer's process requirements. For example, if GE's raw material's RTI Elec temperature is 105 degrees and the customer's baking temperature is 130 degrees, it is apparent that this material does not meet the customer's process requirements. With the increasingly urgent environmental protection requirements, material selection must also meet these demands.

The transformer frame is a crucial component of the transformer's main structure. Transformers are widely used in today's society, and their main structure is indispensable, making the frame indispensable at present.

The role of the frame in transformers includes the following main points: it secures the core within the transformer, provides space for winding the copper wires, and the barrier at the bottom of the frame allows for a fixed connection between the transformer and the PCB board. It also provides a certain distance between the solder pile during soldering and the PCB board, as well as between the core and the PCB board, to isolate the core from the solder pile and prevent poor voltage resistance.

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