There are several classifications of popular laser marking machines on the market today, each catering to different product materials and specializing in various fields. These machines use high-quality laser beams to mark surfaces of different materials, creating exquisite patterns and text through the vaporization of surface materials. Please refer to the introduction for their main applicable fields and characteristics.
Fiber Laser Marking Machine: Utilizing fiber laser technology, it boasts features such as compact size, no water cooling, and excellent beam quality. Suitable for metal materials and most non-metal materials, it is particularly ideal for fields that demand higher precision, finer details, and smoother finishes; including electronic components, integrated circuits (ICs), electrical circuits, mobile communication, hardware products, cutlery and kitchenware, tool accessories, precision instruments, eyewear and watches, computer keyboards, jewelry, automotive parts, plastic buttons, plumbing fittings, sanitary ware, PVC pipes, packaging bottles and cans.
The laser marking machine is available in two types: glass tube and RF tube. It is suitable for non-metallic industries such as food, leather, tobacco, wood products, and electronics.
The end-pumped laser marking machine utilizes a semiconductor laser-pumped solid-state laser as the pumping source, enabling high-power and high-quality laser output by entering the gain medium and cavity mold space. It is suitable for various non-metallic materials such as ABS, nylon, PES, PVC, polycarbonate, and more; and is used in industries including automotive, integrated circuits (IC), electronic components, silicon wafers, electronics, appliances, communication, computers, watches, eyewear, jewelry, and craft decorations.
The UV laser marking machine is developed with a 355nm UV laser source, featuring a 355μm focusing spot that significantly reduces material mechanical deformation and minimizes thermal effects during processing. It is suitable for marking on surfaces of glass, high polymer materials, and for applications such as micro-hole processing, food packaging bottles (boxes), marking on flexible PCB boards, LCD, TFT, cutting, metal or non-metallic coating removal, silicon wafer micro-hole and blind hole processing.
