Industrial-grade Sodium Acetate Trihydrate

Sodium acetate, also known as acetic acid sodium, is an organic compound with the molecular formula CH3COONa and a molecular weight of 82.03. It is characterized by colorless transparent crystals or white granules, which deliquesce in dry air. It loses crystalline water at 120°C and decomposes at higher temperatures. Its relative density is 1.45, melting point is 58°C, and it is easily soluble in water. It can be used as a buffer, mordant, for the determination of lead, copper, nickel, and iron, in culture medium preparation, organic synthesis, film processing, and more.

Application Fields:

1. Measure lead, zinc, aluminum, iron, cobalt, antimony, nickel, and tin. Complexing stabilizer. Auxiliary for acetylation, buffering agent, drying agent, mordant.

2. Used for the determination of lead, zinc, aluminum, iron, cobalt, antimony, nickel, tin. Serves as an esterification agent in organic synthesis, as well as a mordant in dyeing, buffer, chemical reagent, meat preservative, pigment, tanning, and many other applications.

3. Used as a buffering agent, flavor enhancer, fragrance additive, and pH regulator. As a buffering agent for flavoring, it can mitigate unpleasant odors and prevent discoloration, improving flavor when used at 0.1%-0.3%. It has some antimicrobial properties, such as when used at 0.1%-0.3% in fish mince products and bread. It can also be used as an acidulant for sauces, sauerkraut, mayonnaise, fish cakes, sausages, bread, and rice cakes. Mixed with methylcellulose, phosphates, etc., it is used to enhance the shelf life of sausages, bread, rice cakes, etc.

4. Used as a deashing agent for sulfur-regulating chloroprene coking, typically used in an amount of 0.5 mass parts. It can also be used as a cross-linking agent for animal glue.

5. This product can be used as an additive for alkaline electroplating tin, but it has no significant effect on the coating or electroplating process and is not an essential component. Sodium acetate is commonly used as a buffer, such as in acidic zinc electroplating, alkaline tin electroplating, and chemical nickel electroplating.