Focused on providing comprehensive hot melt adhesive bond...

Zhongshan Kenoer Electronics Technology Co., Ltd.
Konnor Enterprises has been deeply involved in the hot melt adhesive industry for 20 years, integrating research and development, production, and sales. We are one of the few domestic tech companies that master stable adhesive technology for extreme environments ranging from -40℃ to 180℃. Relying on German precision technology and our independent R&D system, we offer comprehensive solutions for high and low-temperature-resistant hot melt adhesives to large and medium-sized electronics, electrical appliances, cables, power equipment, and new energy vehicles industries. Our service network covers over 15 countries globally, and our collaborating clients include global leaders such as Gree, Galanz, and Whirlpool.
Core Technology Advantages
Innovative Technology: Hot Melt Adhesive-Free Fiber Technology
● Innovative zero-adhesive fiber spatter technology, breaking through the limitations of traditional adhesive application methods, eliminating fiber pollution and uneven adhesive output issues (accuracy up to ±0.1mm).
Our production line has achieved a cleanliness level of 99.9%, with higher quality products than the industry standard, suitable for high-precision electronic manufacturing environments.
Material Breakthrough: Adhesion Solutions for Difficult-to-Stick Substrates
● Overcoming challenges in bonding non-polar high polymers such as PP/PE/PET and panoramic glass, achieving a bond strength of ≥2100N (30% above the industry average).
● Engineered for complex applications such as home appliance smart manufacturing, new energy vehicles, aerospace, and more, capable of withstanding extreme temperature variations from -40°C to 180°C.
3. Empowering Innovation: Self-developed Intelligent Automation Hot Melt Adhesive Equipment
Offer a full-chain closed-loop service for "adhesives + intelligent devices," addressing the pain points of low efficiency and uneven manual adhesive application.
● Helping clients achieve dual breakthroughs in quality and efficiency.
Cost Reduction and Efficiency Enhancement
● Helping clients reduce adhesive selection costs by 30%, improving yield to 99.8%, and boosting production efficiency by over 50%, saving over 300,000+ annually in comprehensive costs.
Application Scenarios and Solutions
Core Areas
Electrical Power | Home Appliance Intelligent Manufacturing | New Energy Vehicles | Aerospace | Low-altitude Economy
Key Features
● Adhesives and FastenersPower adapter mounting, cable terminal protection, control board component bonding and fixation.
● Structural AdhesiveStructural bonding for microwaves, ovens, dishwashers, washing machines, etc., as well as bonding and fixation of glass windows and doors, and metal mechanisms.
● Packaging ProtectionElectronic component packaging, power module encapsulation, wafer-level packaging industry, 5G and 6G high-speed line packaging, smart phone and electric vehicle battery packaging, as well as packaging for sensors in the Internet of Things. Enhancing the integrity of electronic devices, improving shock and impact resistance; boosting insulation properties, supporting equipment lightweighting.
● Triple Protection TechnologyWaterproof/dustproof/shockproof, suitable for harsh environments such as circuit board protection and component sealing.
International Certification and Quality Commitment
● 750℃/850℃ Hot Wire Test Certification:(Exceeds IEC60695 standards and has received certification.)
● Environmental Certification:All products have passed over 200 international environmental and safety certifications, including ROHS/REACH.
● Certified by authorized bodies:UL, SGS, CTI certified; technical specifications on par with international benchmarks like Hanhao, 3M, etc.
Konor Wang - Focused on high and low temperature heat melting adhesive bonding technology, ensuring export quality and safety.
Choose Konor Wang, build the future together!
Define industry standards through technological innovation and empower China's intelligent manufacturing with a global layout.
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