When it comes to headers and sockets, they are almost universally recognized in the electronics component industry, as they are a common sight on circuit boards. But how much do you know about the role of their plating? A manufacturer specializing in headers and sockets with years of experience today shares knowledge about plating.
The purpose of electroplating on PIN needles is to establish and maintain the stability of electrical performance, which requires electroplating (tin or gold plating) on the metal contact surfaces. Ordinary metal coatings utilize electrolytic action to form an antioxidant film on the surface, thereby providing anti-corrosion, improved wear resistance, conductivity, and reflectivity, among other benefits.
The thickness of the coating is generally determined by electrical performance parameters. So, how can the quality of the coating be verified? Several relevant tests are typically conducted.
1. Appearance Testing: The inspection method primarily involves checking for surface issues on the PIN needle plating, such as scratches, dents, deformation, discoloration, foreign matter (dust, oil, crystalline substances) adherence, peeling of the plating layer, blisters, dents, or granular matter, etc.
2. Film Thickness Testing: The method involves using a fluorescent electroplating film thickness meter to check whether the actual thickness of the PIN needle meets the specifications.
3. Adhesion Test: Poor adhesion of the coating on PIN needles is a common issue in electroplating. There are two methods for testing it: the bending test and the tape test.
4. Soldering Ability Test: Defects that require post-welding processes are not permitted. Basic methods of welding tests include direct dipping and aging before welding.
5. Corrosion Resistance Testing: The methods include salt spray testing, nitric acid vapor testing, hydrogen sulfide vapor testing, sulfur dioxide vapor testing, and water vapor aging testing. After testing, the PIN needles must not show signs of oxidation or functional variation.



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