The surface of the heat sink should be free of shrinkage holes, rust, cracks, and other defects.

2. Metal fasteners for flat heat sinks (pressure plates, pressure caps, disc springs) and conductive fins of water-cooled radiators should be coated for protective purposes.

The surface roughness Ra of the heat sink surface is allowed to be a maximum of 3.2m.

The heat sink surface flatness is not less than 9 grades.

5. Heat sinks for wet tropical electrical semiconductor devices (including radiators, fasteners, and insulators) should be treated with protective coating, and their resistance to humidity, salt mist, and mold should meet the corresponding tropical electrical semiconductor device standards.

6. Fasteners and insulating components for radiators should comply with GB/T 446.3 (Insulating and fastening components for radiators of power semiconductor devices).

7. The torque or clamping pressure for the installation of heat sinks and power semiconductor devices should comply with the relevant regulations of the device product standards.

The types of heat sinks can be roughly categorized into: aluminum extrusion heat sinks, plate heat sinks, high-density fin heat sinks, and combination heat sinks.

When high heat dissipation is required, aluminum extrusion radiators or scraper radiators should be chosen. This is because aluminum extrusion radiators are made through a single extrusion molding process, offering rapid heat conduction and minimal thermal degradation. However, not all aluminum extrusion radiators may perfectly fit the user's electronic device space planning, so selection based on the manual and subsequent machining processes like milling are necessary.

When users have low heat dissipation requirements and need to plan for component installation space, they can opt for a plate heat sink or a combination heat sink. These electronic heat sinks can be custom-machined to the required shape and size according to the user's CAD drawings. Currently, most plate heat sinks can also meet ultra-high power heat dissipation needs, offering great flexibility in dimensions.

When users require higher levels of cooling, it's advisable to consider high-density fin heat sinks or liquid cooling solutions, among other high-power electronic cooling products. As the name suggests, high-density fin heat sinks feature a large fin density (fin spacing) and tall fins, along with thick substrates, which effectively multiply the surface area for cooling. When paired with fans, the cooling performance is even more pronounced. Liquid cooling solutions offer a more efficient electrical cooling solution and are categorized into contact and non-contact types: allowing fluids to directly contact electronic devices to dissipate heat, or devices to be in contact with the liquid cooling fins, allowing the internal circulation system to remove heat.