Surface Quality Requirements

The surface of the heat sink should be free of defects such as shrinkage holes, rust, and cracks.

2. Metal fasteners (clamp plates, clamp covers, disc springs) for flat heat sinks and conductive fins of water-cooled heat sinks should be coated with a protective layer.

3. The surface roughness Ra of the heat sink table is not to exceed 3.2m.

The heat sink surface flatness is not less than 9 grades.

5. Heat sinks for wet tropical power semiconductor devices (including radiators, fasteners, and insulators) should be treated with protective coatings, and their resistance to moisture, salt spray, and mold should meet the corresponding tropical power semiconductor device standards.

6. Fasteners and insulators for radiators should comply with GB B446.3 (Insulators and fasteners for radiators used with power semiconductor devices).

7. The torque or clamping pressure for the installation of heat sinks and power semiconductor devices should comply with the relevant provisions of the product standards for the devices.

The types of heat sinks can be broadly categorized into: aluminum extrusion heat sinks, plate heat sinks, high-density fin heat sinks, and combined heat sinks.

When high heat dissipation is required, aluminum extrusion radiators or scraper radiators should be chosen. This is because aluminum extrusion radiators are formed by one-time extrusion molding, offering rapid heat conduction and minimal thermal degradation. However, not all aluminum extrusion radiators may perfectly match the space planning of the user's electronic devices, so selection based on the manual and subsequent processing such as milling the outer shape is necessary.

When users have low heat dissipation requirements and need to plan for component installation space, they can opt for a plate heat sink or a combination heat sink. These electronic heat sinks can be custom-machined to the required shape and size according to the user's CAD drawings. Most plate heat sinks on the market can also meet ultra-high power heat dissipation needs, offering great flexibility in dimensions.

When users' cooling requirements reach a higher level, it's advisable to consider high-density fin heat sinks or liquid cooling solutions, among other high-power electronic cooling products. High-density fin heat sinks, as the name implies, have a very large fin density (fin spacing) and tall fins, as well as a thick substrate, which effectively increases the cooling surface area. When paired with fans, the cooling effect is even more pronounced. Liquid cooling solutions offer a more efficient electrical cooling solution and are further categorized into contact and non-contact types: allowing fluids to directly contact electronic components to dissipate heat, or the components can be in contact with the liquid cooling fins on the surface, allowing the internal water circulation system to remove the heat.