Coated Silicon Wafers, Silicon Dioxide, Single Crystal Round Wafers with Non-Standard Cutting, Microstructure Processing

Our company provides laser marking technology solutions to clients both domestically and internationally. We are a large-scale, professional laser processing factory integrating laser engraving, laser cutting, laser marking, laser processing, laser cutting, and laser engraving. Specializing in various laser processing services, we have gradually developed into a professional laser marking and engraving processing factory, thanks to our expert laser engraving technology and years of experience in laser processing.

Our laser marking processing is widely used in various fields, including iron and steel metallurgy, non-ferrous metals, automotive parts, aerospace, precision instruments and meters, machinery manufacturing, molds, hardware tools, integrated circuits, semiconductor manufacturing, solar energy, food and beverage, packaging, shoe materials and leather, plastics and rubbers, jewelry and accessories, and numerous metal and non-metal industries.

Ultraviolet Laser Marking Machine Features: The ultraviolet laser marking machine, due to its small focused spot and minimal thermal effect during processing, is ideal for precise marking and special material marking. Customers with high requirements for marking quality can choose this product. The marking process of the ultraviolet laser marking machine does not generate heat, resulting in precise and smooth cutting with vertical side walls, without thermal effects or burning issues. Many materials, excluding copper, absorb ultraviolet light at 355nm, making the ultraviolet laser suitable for processing a wider range of material types.

Our company adheres to the business philosophy of good industry practices, professional pursuit, honest operation, and stable development, and is eager to tackle various challenging issues in laser processing. We are delighted to join hands with you for a win-win collaboration!