Silicon Wafer, Silicon Carbide, Semiconductor Wafer, Pore Machining, Porous Machining

We offer laser marking technology solutions to customers worldwide. As a large-scale, professional laser processing factory, we integrate laser engraving, laser cutting, laser marking processing, laser cutting, and laser engraving into one. Specializing in all types of laser processing services, we have gradually developed into a professional laser marking and engraving processing factory, thanks to our expertise in laser engraving technology and years of experience in laser processing.

Our laser marking processing is widely used in fields such as iron and steel metallurgy, non-ferrous metals, automotive parts, aerospace, precision instruments and meters, machinery manufacturing, molds, hardware tools, integrated circuits, semiconductor manufacturing, solar energy, food and beverage, packaging, shoe materials and leather, plastics and rubbers, jewelry and accessories, and numerous metal and non-metal sectors.

Ultraviolet Laser Marking Machine Features: The UV laser marking machine, with its small focal spot and minimal thermal effect on processing, allows for precise marking and special material marking. Customers with high requirements for marking quality can choose this product. The marking process of the UV laser marking machine does not generate heat, resulting in precise and smooth cutting with perpendicular side walls, without thermal effects or burning issues. Many materials, excluding copper, absorb UV light at 355nm, making the UV laser suitable for processing a wider range of material types.

Our company adheres to the business philosophy of industry excellence, professional pursuit,诚信 operation, and stable development, and is eager to tackle various challenging issues in laser processing. We look forward to joining hands with you to create a win-win situation!