Wafer Sawing, Semiconductor Wafer Sawing, Wafer Sawing for Wafers, Film Cutting, Custom Masks
13011886131
Company Introduction
Tianjin Huano Precision Technology Co., Ltd. offers professional laser marking, laser engraving, laser etching, and a full range of laser processing services. We provide laser marking technology solutions for clients both domestically and internationally. As a large-scale, professional facility, we integrate laser engraving, marking, etching, laser processing, cutting, and laser etching. Specializing in various laser processing projects, we have developed into a specialized laser marking and etching processing factory, thanks to our expertise in laser etching technology and years of experience in laser processing.
To meet the diverse processing needs of our extensive clientele, our company boasts a variety of laser marking and engraving equipment, including infrared laser marking machines, fiber laser marking machines, semiconductor laser marking machines, CO2 laser marking machines, UV laser marking, high-precision jewelry laser marking, plastic parts laser marking, portable CO2 high-reliability laser marking, and mobile laser marking suitable for large workpieces. Our laser marking services are widely applied in steel metallurgy, non-ferrous metals, automotive and parts, aerospace, mechanical manufacturing, molds, hardware tools, and more.Footwear Materials & LeatherIntegrated circuits, semiconductor manufacturing, solar energy, food and beverage, packaging, plastics and rubber, jewelry and accessories, craft gifts, and various metal and non-metal fields.
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Service Hotline

Company Telephone
13011886131

Address
No. 12, 2nd Building, 1st Floor, Haitai Development Road, Huanai Industrial Zone, Tianjin Binhai High-Tech Zone (Outer Ring)
b2b.china9.net © Zhongshang 114 Hebei Network Technology Co., Ltd.Address: Room 6009, Oriental New World Center, No.118 East Zhongshan Road, Qiaoxi District, Shijiazhuang City, Hebei ProvincePlatform Service Hotline: 4006299930
