The electroplated copper round steel grounding wire material, inspired by foreign technology, involves electroplating 99.9% pure copper molecules onto a low-carbon steel core, creating a novel composite material with a high molecular bond between copper and steel. It overcomes the drawbacks of traditional tube coating methods, such as galvanic reactions, and also solves issues like low copper purity and uneven copper layer thickness in hot dipping continuous casting processes. During construction, the electroplated copper-clad steel material can be freely bent and cut to length without the copper layer peeling or detaching. Consequently, in recent years, the use of electroplated copper-clad steel as grounding material has been widely recognized and highly praised by domestic and international customers.

Utilizing electroplating production technology, we achieve a high degree of integration between copper and steel. The outer copper layer is composed of 99.99% electrolytic copper, overcoming the drawbacks of galvanizing process, such as the original battery reaction, and also solving issues like insufficient copper purity and surface copper layer anode-cathode problems in the hot-dipping continuous casting process.